梁剑

中兴通讯股份有限公司 | 元器件工艺工程师

演讲摘要：随着大模型的发展，算力芯片的能力突飞猛进，芯片尺寸也越来越大。如何解决大尺寸芯片组装及可靠性面临的问题，是业界同仁的共同难题。本次演进通过分享大尺寸芯片的钢网设计、炉温设计、贴片过程、焊接后检查需要考虑的要素，以及大尺寸芯片焊点可靠性问题发现的过程和部分解决思路，共同探讨此类问题的解决方案。

Erkko Helminen

TTM Technologies, Inc. | Senior manager of Commercial Technology

陈靖

上海望友信息科技有限公司 | 产品总监

演讲摘要：随着电子行业的高端化转型，原有以数量和价格为指导的发展模式已转向以质量和品牌为核心的高速扩张，企业及市场对于产品质量及可靠性提出越来越高的要求。《制造业可靠性提升实施建议》明确提出需强化可靠性技术攻关、推动数字化赋能。然而，随着产品多样性发展及复杂度激增，跨组织协同失效、装配工艺难度升级、工艺人才短缺已成为制约产品质量与可靠性的核心瓶颈，传统装配工艺与设计审查方式已难以应对新兴的制造挑战。 Vayo DFA软件针对目前行业困境，为企业提供一套智能化的可装配性设计分析解决方案。软件以数字样机为核心，覆盖PCB/PCBA互联设计、机电协同设计、仿真设计等多种应用场景，通过自动化的3D干涉检查，快速识别器件间、PCBA与结构件或线缆间、多个PCBA间的装配风险隐患，并输出3D可视化装配风险报告。依托强大的数据处理及规则管理功能，软件可帮助企业快速构建数字化工艺资产管理能力，实现企业知识持续积累与复用；同时提供智能线缆布设功能，显著提升效率并降低成本。切实帮助企业实现装配工艺过程的标准化、智能化管理，驱动高效、零缺陷的数字化制造，加速数字化样机实现！

汪实利

太阳油墨（苏州）有限公司 | 营业战略室长

Peter Tranitz

Global Electronics Association | Senior Director Technology Solutions

演讲摘要：The Next Generation Design Initiative emphasizes the importance of silicon-to-systems co-design and co-optimization, as well as collaboration throughout the electronics value chain. A Single Source of Truth and model-based definitions are important enablers. There is a special focus on the interface between component-level and system-level packaging, also known as the Package-PCB interface. The Design Leadership Council and the internal design team of the Global Electronics Association have published thought leadership papers to address these needs and guide the industry through IPC standards. Training programs have been developed to promote understanding of the electronic design process and its specializations in various industries. Furthermore, we provide an overview of the Global Electronics Association's upcoming design events and introduce new solutions that facilitate the application of IPC standards for Design for Manufacturability checks.