王辉东

深圳市一博科技股份有限公司 | DFM技术专家

韩志浩

环旭电子股份有限公司 | SiP Module DFM Manager

演讲摘要：1. 高密度零件贴装 20微米探索；2. 双面模塑I/O散出方案探索；3. 更多空间节省方案探讨

孙宸 博士

工业和信息化部电子第五研究所 | 重点实验室高级工程师

演讲摘要：随着电子封装技术高速发展，封装工艺缺陷类型不断增加并严重降低芯片的质量与可靠性，传统的缺陷识别技术面临着工作量大、周期长、误判率高、定位不准确等问题。本文系统介绍了当前先进封装的发展趋势，全面梳理了工艺制程风险，研讨利用AI先进技术手段，智能、高效、精确识别封装工艺缺陷的技术方案，并提供了典型案例。

崔风洲

深圳市美信检测技术股份有限公司 | 半导体事业部总经理

演讲摘要：聚焦汽车电子元器件的失效分析与可靠性评价。内容涵盖汽车电子行业现状、失效分析（FA）方法、典型失效案例（如潮敏失效、电迁移、封装缺陷等）、AEC-Q认证流程及重要性。美信检测作为CNAS/CMA认证实验室，提供半导体全生命周期技术服务，助力汽车电子高可靠性需求。

Devan Iyer, Ph.D

Global Electronics Association | Chief Strategist for Advanced Packaging

演讲摘要：Advanced electronic packaging is a vital technology that enables the integration of high density, high speed and high-power electronic devices in small form factor packages at component level and modules/ board assembly at subsystem/system level. Power delivery, thermal management, assembly and reliability at component and system level demand innovative design approaches, materials and assembly processes for high quality, reliability and efficient manufacturing. As technologies constantly evolve in areas like Artificial Intelligence (AI), 5G/6G, Electric and Autonomous vehicles, and the Internet of Things (IoT), chip to package interaction at the component level packaging and package to board interaction at the system level packaging are indispensable from system level integration and final product /system performance point of view.